number of plies

1~32 layer

Number of layers, means the number of electrical layers (copper clad layers) in PCB

At present, only the through-hole plate (not blind buried hole plate) adopts true A-class FR 4 plate material, 1.6mm plate thick 8 cloth (this process parameter list does not specifically refer to FR 4 board)

laminar structure

4,6,8,10,12,14,16,18,20 (maximum 32)

Please see the company compression process sop

Plate type

FR 4 (Grade A)

Board material has "Taiwan, China South Asia", "Jiantao KB", "Shengyi", "HongRuixing" and other A-class board material

High frequency plate

Currently making"Double-sided high-frequency plate (1 oz copper thick): Rogers (Rogers), PTFE (ferroflurone)

aluminum substrate

Currently making"Single-sided aluminum substrate"

Copper substrate

Currently making"Single-sided / double-sided thermoelectric separation copper substrate(Cump 1mm width)

FPC soft board

Currently making"Double and even soft board"

Overall process

maximum dimensions

FR 4:670 * 600mm high-frequency plate: 590 * 438mm aluminum plate: 602 * 506mm copper plate: 480 * 286mm

The listed data shall be suitable for the FR 4 maximum size of 0.8mm plate and <0.8mm, 500 * 600mm, maximum order size of FR 4 single panel: 606 * 510mm.1 oz copper thickness FR 4 double panel limit order size: 1020 * 600mm, but according to the process and plate thickness specified to the corresponding factory for production: 1) Jin Yuetong factory: processing plate thickness is 1.2mm, 1.6mm, resistance welding ink color is green, blue, surface treatment for lead injection tin and lead tin order 2) advanced three factory: processing plate thickness is 1.0mm, 1.2mm, 1.6mm, welding ink color is green, black, white, surface treatment for lead injection tin, no lead injection tin, heavy gold orders

lower limit

General: 3 * 3mm (10mm for half hole process)

The listed data shall be suitable for 0.6mm plate thickness and <0.6mm plate thickness, as recommended for processing.

thickness range

0.4-4.5mm

FR 4 production plate thickness: 0.4/0.6/0.8/1.0/1.2/2.0mm (2.5-4.5mm can be made above 12 layers, subject to system options)

The outer layer is copper thick

Finished copper thickness:

Double-panel (1oz,2oz,2.5oz,3.5oz,4.5oz)

Multilayer board (1 oz, 2 oz)

The inner layer is copper thick

Thick copper of the finished product: 0.5 oz, 1 oz, 2 oz

Line making

Graphic plating (tin plating process)

Type of welding resistance

Light-sensitive ink green purple red yellow blue white black

Light ink is now the most used type, thermosetting oil is generally used in low-grade single-sided cardboard

Surface coating

There is lead tin, no lead tin, sink gold

FR 4 plate material can be made of these three processes (6 layers above multilayer plate and high frequency plate for gold) plate thickness 0.4mm not tin spray aluminum substrate only tin, copper substrate only OSP

drill

Drilling aperture

Single panel: 0.3~6.3mm double panel: 0.15~6.3mm multilayer board: 0.15~6.3mm

The hole of 6.5mm drill bit adopts reaming / gong edge processing double panel, multilayer board minimum drilling hole 0.15mm (unconventional! Please use with caution for high cost) the minimum drilling of aluminum substrate 0.65mm, the minimum drilling of copper substrate 1.0mm sinking hole, blind groove, back drilling process has been opened

hole tolerance

Jack hole diameter: + 0.13/-0.08mm press hole diameter: + / -0.05mm (multi-layer gold sinking plate only, order special note)

For example, the design of 0.6mm hole, the finished aperture of the physical plate is 0.52-0.73mm (to avoid ink or tin injection, the diameter of the insert hole should be 0.5mm)

Minimum overhole / welding pan

Single panel: 0.3mm (inner diameter) / 0.5mm (outer diameter) double panel: 0.15mm (inner diameter) / 0.25mm (outer diameter) multilayer panel: 0.15mm (inner diameter) / 0.25mm (outer diameter) ① outer diameter must be 0.1mm larger than the inner diameter, recommended 0.15mm ② minimum hole recommended 0.2mm ③ double panel, unconventional aperture, plug ink (resin)

The minimum has copper groove holes

Slot width: 0.5mm (length 2 times width)

Minimum copper-free groove hole

Trough width: 1.0mm (0.6mm wide slot less than 5mm, please order and note)

Half hole process

Half hole finger plate edge half hole and the hole wall has copper, mostly used for welding child plate: ① half hole aperture (Φ): 0.6mm ② half hole edge to plate edge (L): 1mm ③ half hole edge to half hole edge (D):≧0.6mm④ single plate minimum size: 10 * 10mm ⑤ half hole process plate thickness: 0.6mm

Pack edge process

The side of the edge finger board all cover copper sink gold (temporarily do not spray tin): ① edge process minimum size: 10 * 10mm ② edge process plate thickness: 0.6mm ③ all sides all sides, need 3mm wide no copper connection (at least 3 groups, large size needs 4 groups or above)

The hole sinking process

The sink hole is a cone hole drilled to keep the head of the screw below the PCB surface and avoid the screw head bulge affecting the overall thickness ① sink angle (R): 90°, 135 °② sink diameter (W):0.5-6.4mm③ through hole diameter (D):≥0.3mm④ sink depth (L):≥0.1mm⑤ safe distance (S):≥0.2mm⑥ minimum residual thickness (T):≥0.2mm⑦ 2-32 layer FR 4 plate of 0.6mm, aluminum substrate, copper substrate

Blind trough process

Blind groove through the groove, then embedded components or cooling copper, and assemble the device after heat ① blind groove width (W):≥1.0mm② blind groove depth (D):≥0.2mm③ blind groove ring width (A):≥0.3mm (the disc width of PTH blind groove) ④ safe distance (S):≥0.2mm (NPTH blind groove to adjacent line pattern distance) ⑤ blind groove thickness (R):≥0.2mm (the bottom to the nearest inner copper layer / surface substrate distance) ⑥ support plate 0.8mm thick 2-32 layer FR 4 plate

Back drilling process

Back drill through the secondary drill hole, Control the drilling depth, Drilling off excess copper of PTH through other layers, Reduce its interference to the signal ① through hole diameter (D):0.2-0.5mm (back drill plug resin filling) ② back drill diameter (D): 0.2 mm larger than through hole drill ③ back drill depth (L): specified by the customer through level ④ medium thickness (T):≥0.15mm (back drill bottom to the nearest copper layer distance) ⑤ safe distance (S):≥0.2mm (refers to the back drilling edge to adjacent line pattern distance) ⑥ supports 0.8mm plate thickness of 4-32 layer FR 4 plate

circuit

Minimum line width / line gap (1 oz)

Single-double panel: 0.10/0.10mm (4 ml / 4 ml) multilayer board: 0.09/0.09mm(3.5mil/3.5mil), local line width at BGA can be 3 mil

Minimum linewidth / linegap (2 oz)

Double panel: 0.16/0.16mm(6.5mil/6.5mil) multilayer board: 0.16/0.16mm(6.5mil/6.5mil)

Minimum linewidth / linegap (2.5 oz)

Double panel: 0.2/0.2mm (8 mil / 8 mil)

Minimum linewidth / linegap (3.5 oz)

Double panel: 0.25/0.25mm (10 mil / 10 mil)

Minimum linewidth / linegap (4.5 oz)

Double panel: 0.3/0.3mm (12 mil / 12 mil)

Line width tolerance

±20%

For example, the line width is 0.1mm, and the solid plate line width of 0.08-0.12mm is qualified and allowed

Plate edge to line edge spacing

0.1mm (as far as possible greater than this parameter), BGA pad to line minimum 0.09mm

Copper insert hole ring (1 oz)

Double panel: 0.25mm (recommended value), limit value of 0.18mm

Multilayer board: 0.20mm (recommended), limit of 0.15mm

No copper insert hole welding ring

0.45mm (recommended value), because of the dry film sealing hole, the 0.2mm welding pad or copper surface will be emptied around the no copper hole. Please try to increase the welding pad for welding. The welding pad is too small may be a coil or no welding pad

BGA

① BGA disc diameter: 0.25 mm② BGA disc side to line: 0.1mm (multilayer plate minimum 0.09mm) ③ BGA disc hole in the middle can be resin / copper paste plug hole + cap plating

Coil plate

① minimum line width of coil of cover oil: 0.15/0.15mm (1 oz copper thickness) ② minimum line width of coil of window: 0.25/0.25mm (1 oz copper thickness), only support gold sinking, tin spraying is easy to adhesion

Resistance welding

Welding window opening

Double panels: 0.038mm for the welding plate, and the distance between the window opening is 0.05mm

Multilayer plate: welding plate and window opening press 1:1 design

Through the hole plug ink

With resistance welding oil ink plug into the hole to achieve light opaque effect: ① double-sided pad cover oil to plug the ink ② double panel hole to the window plate side 0.35mm hole, inconvenient to plug ink ③ all plug ink through the hole diameter 0.15-0.5mm

Hole plug resin + plating cap and hole plug copper slurry + plating cap

With resin / copper slurry plug into the hole and flat cap on the hole surface ① resin / copper slurry plug hole plating cap filling treatment (select copper slurry plug hole with high thermal conductivity requirements) ② 6 layer and above multilayer plate hole default hole plug resin + electroplating cap ③ all plug resin / copper slurry hole diameter 0.15-0.55mm

Welding thickness

≧10um

Minimum resistance welding bridge design data (
See details)

character

Character height

1mm (special font, Chinese, hollowed character higher)

Character thickness

0.15mm (below this value may not be printed)

Character to the copper exposed pad clearance

0.15mm (below this value will empty the character to avoid the upper pad)

end product

Gong edge forming

① The distance between the line and the pad and the plate is 0.2mm ② The distance between the wire and the disc is 0.2mm ③ the gong edge appearance tolerance: ± 0.2mm (Pu gong), ± 0.1mm (fine gong) ④ fine gong board single piece length and width size 50 * 50mm (fine gong needs 3 positioning holes in different directions, diameter 1.5mm) ⑤ aluminum substrate / copper substrate minimum gong groove width 1.6mm

V cut splint

The distance between the wire and the pad at the ① V cut edge 0.4mm ② V cut shape tolerance: ± 0.4mm (V cutting plate thickness 0.6mm) ③ default 0 clearance plate (only V needs to cut two sides, the other two sides can use 1.6mm or 2mm plate clearance to open the gong) ④ V cut minimum plate size: 70mm maximum plate size: 475mm ⑤ the adjacent two V cutting line interval 3mm (limit 2mm)

Stamp hole spelling board

① Non-stamp hole wire and welding pad from the plate edge 0.2mm ② non-stamp hole gong tolerance: ± 0.2mm (Pu gong), ± 0.1mm (fine gong) ③ default 1.6mm or 2mm plate gap ④ stamp hole plate with gear ⑤ process edge width minimum 3mm (our SMT needs 5mm wide, light point 1mm, positioning hole 2mm, light point to plate edge 3.85mm)

Board thick tolerance

Plate thickness 1.0mm, plate thickness tolerance + / -10% plate thickness <1.0mm, plate thickness tolerance + / -0.1mm

For example, the plate thickness is T=1.6mm, the physical plate thickness is 1.44mm(T-1.6×10%)~1.76mm (T + 1.610%); the plate thickness is T=0.8mm, the physical plate thickness is 0.7mm(T-0.1)~0.9mm (T + 0.1)

design

AD

① The groove to be processed must be placed in the same layer as the shape, and the only shape layer in the data ② the groove to be processed cannot be checked Keepout (Chinese version shows "make outside". Note: this option is absent in AD17 or above)

EDA

Draw slot holes as far as possible

ADS
Mine-clearing PADS at error-prone points

① PCB manufacturer is the use of reduced copper (Hatch), PADS software design customers must pay attention to ② if there are more non-metalligrooves on the plate, please use outline painting