project | process capability | Process detailed solution | Illustration |
number of plies | Layer 1, layer 2 | The number of layers refers to the number of FPC line layers | Can produce soft and hard composite board |
FPC structure | Regular FPC single panel | Plate for single-sided circuit (PI thickness: 25um) |
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Regular FPC dual panel | Plate for double-sided circuit (PI thickness: 25um) |
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Ultra-thick FPC single panel | Plate of single-side line (PI thickness: 50um, not easy to tear) |
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Ultra-thick FPC double panel | Double-sided line plate (PI thickness: 50um, not easy to tear, suitable for impedance plate) |
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Clear FPC single panel | Plate for single face line (PET thickness: 36um) |
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Clear FPC double panel | Plate for double-sided circuit (PET thickness: 36um) |
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Overall process | maximum dimensions | Routine: 234X490mm | Limit 250X500mm, need to have a process edge, order need to find the business specialist confirmation |
lower limit | No limit, but less than 20X20mm recommended spelling | ||
FPC thickness of slab | ① Conventional single panel 0.07mm,0.11mm② Conventional double panel 0.11mm,0.12mm,0.2mm③ super thick FPC single panel 0.12mm, double panel 0.19mm ④ transparent FPC single panel 0.14mm, double panel 0.24mm | ① Refers to the thickness of FPC soft board, excluding the thickness of reinforcing material ② white cover film is 10um / surface thicker than yellow and black | |
The outer layer is copper thick | Single-panel 18um(0.5oz), 35um (1 oz) dual-panel 12um(0.33oz),18um(0.5oz), 35um (1 oz) | Refers to the copper foil thickness of the FPC line layer | |
Line making | Using a dry film process, LDI exposure (direct laser imaging technique) | LDI is more accurate than the traditional LED exposure machine, which can automatically align according to the size of the board to eliminate the problem of hole deviation | |
surface preparation | Gold sinking, thickness: 1u ", 2u" | Refers to the nickel gold layer on the surface of the wire pad to prevent the oxidation of the pad | |
The thickness of the reinforcing area | Total thickness of reinforcement area = FPC plate thickness + reinforcement thickness | ||
Board thick tolerance | ± 0.05mm (limit ± 0.03mm) | The thickness tolerance of the reinforcement area is also applicable. The thicker the reinforcement, the greater the tolerance | |
drill | Drilling aperture | 0.1-6.5mm | The maximum aperture of PTH holes (with copper metalliholes) is recommended to be designed within 5mm |
hole tolerance | ±0.08mm | Such as: 1.0mm hole, according to the 0.92-1.08mm acceptance is qualified | |
Minimum overhole / welding pan | ① General: 0.15mm (inner diameter) / 0.35mm (outer diameter) ② limit: 0.10mm (inner diameter) / 0.3mm (outer diameter), will increase the cost ③ recommended overhole inner diameter 0.3mm, 0.55mm ④ outer diameter must be 0.2mm larger than the inner diameter, recommended more than 0.25mm |
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The minimum has copper groove holes | 0.5mm |
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Minimum copper-free groove hole | no requirement | The distance between the copper-free groove hole edge and the copper paving edge shall be over 0.2mm | |
Half hole process | Half hole finger plate side half hole and hole wall has copper, mostly used for pressure welding finger: ① half hole aperture: 0.3mm ② half hole welding pad edge to plate edge: 0.5mm ③ half hole edge to half hole edge 0.4mm |
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circuit | Minimum linewidth / linegap | ① Copper thickness 12um(0.33oz): 3 / 3 mil (limit 2 / 2 mil, try not to design) ② copper thick 18um(0.5oz):3.5/3.5mil③ copper thick 35um (1 oz): 4 / 4 mil above is the conventional ability, there are special requirements, can contact the business specialist |
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Line width tolerance | ±20% | For example, the line width is 0.1mm, and the solid plate line width of 0.08-0.12mm is qualified and allowed | |
Plate edge to line edge spacing | ① Outer diameter to line: 0.1mm (as greater as this parameter as possible) ② Open pan to line: 0.15mm (as greater than this parameter as possible) |
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Copper insert hole welding ring | 0.25mm (recommended value), limit value of 0.18mm |
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NPTH hole (no copper hole) to copper spacing | ≧0.20mm | Including NPTH to the line, to the pad and to the copper skin | |
BGA | ① BGA disc diameter: 0.25 mm② BGA pan side to line side: 0.2mm (this parameter is greater than 0.2mm to ensure no line exposure) |
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Weld resistance (cover film) | Weld resistance color (cover film color) | Yellow, black, white, and transparent | Yellow is recommended, the cheapest price |
Resistance welding window (cover film window) | The window opening is 0.1mm larger than the welding pad, and the distance between the window opening and the line sides is 0.15mm (greater than this parameter as far as possible) |
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Overhole cover | It is generally recommended to cover the hole with a covering film (no welding pad) | ||
Weld resistance thickness (covering film thickness) | ① Conventional FPC covering film 1) PI thickness: 12.5um/ adhesive thickness: 15um (12um, 18um copper foil used) 2) PI thickness: 25um / adhesive thickness: 25um (35um copper foil used) ② transparent FPC covering film: PET25um / adhesive thickness: 25um ③ super thick FPC covering film: PET 50um / adhesive thickness: 50um Note: white covering film is 10um thick than yellow and black |
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Minimum resistance weld bridge width (cover film bridge width) | 0.5mm, that is, the pad spacing of 0.5mm can protect the bridge, less than this value default window.(The above is a routine ability, if there are special requirements, you can contact the business specialist) |
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character | Character height | 1mm (special font, Chinese, hollowed character higher) |
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Character thickness | 0.15mm (below this value may not be printed) | ||
Character to the copper exposed pad clearance | 0.15mm (below this value will empty the character to avoid the upper pad) | ||
shaping | Laser cutting / die charge | ① Distance between wire and pad 0.3mm ② wire and pan 0.3mm ③ Appearance tolerance: ± 0.1mm (special control ± 0.05mm) |
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Goldfinger PAD to the board edge | 0.2mm (not enough 0.2mm for default gold finger, 0.2mm from the margin finger to the edge of the plate to prevent laser cutting carbonization, except for half-hole pressed gold finger) |
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makeup | ① Plate spacing is generally 2mm, with steel sheet reinforcement, interval according to 3mm design ② process edge 5mm, all around the add, the edge of the copper (copper 1mm from the light point, 0.5mm) ③ light point 1mm, 2mm, light point center to the plate edge 3.85mm (add four, one of the need to stagger 5mm prevention) ④ connection point length 0.7-1.0mm⑤ plate maximum size 234X490mm |
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reinforce
| PI reinforce | Thickness of 0.1mm,0.15mm,0.20mm,0.225mm,0.25mm | PI reinforcement is often used in golden finger insertion products. For example, the total thickness of golden finger is 0.3mm and the thickness of FPC plate is 0.11mm. It is recommended to use 0.225mm PI reinforcement |
FR4 | Thickness 0.1mm,0.2mm,0.4mm,0.6mm,0.8mm,1.0mm,1.2mm,1.6mm (thick FR 4 also uses AD adhesive thermal pressure) | FR 4 is suitable for relatively low-end products, easy to drop powder, as little as possible If there is a hole and this area corresponds to the FPC pad design, the pad surface may be depressed | |
steel disc | Thickness of 0.1mm,0.2mm,0.3mm | The price of steel sheet is relatively high, but the flatness is good, will not deform, suitable for the need for chip patch products (steel sheet has weak magnetic, similar to the hall element products are not recommended) | |
3M double-sided glue | 3M9077 (thickness 0.05mm, high temperature), 3M468 (thickness 0.13mm, not high temperature) | Generally used for fixing the FPC plates during assembly | |
Electromagnetic shielding film | The thickness is 18um (black), which is used to solve EMC problems. Generally, it is recommended to add grounding Windows in the welding resistance layer, so that the electromagnetic shielding film can connect with copper and increase the shielding effect. |
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design | impedance | ① Dielectric constant of substrate 3.3, dielectric constant of cover membrane 2.9 ② substrate PI thickness: conventional FPC 25um / super thick FPC 50um | Temporary does not support the measurement of impedance, only control line width, Jiali chuang provides impedance reference line width, |
Asia-Pacific EDA (highly recommended) | Asia Pacific EDA professional edition has a special FPC reinforcement layer, can draw different shapes of the reinforcement and specify different thickness, order no need to fill in the reinforcement information, enjoy the Asia Pacific EDA design FPC discount
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lse EDA | A separate layer is required to mark the reinforcement area, material and thickness, and fill in the reinforcement information (Note: the explanatory character indicating the reinforcement should not be placed in the board) |
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Routine design requirements | Drilling, route, welding resistance, text design in the same way as the hard plate |
Process Capability